an increase in power from previous models to 140 w ensures that is enough power for perfect desoldering of components on multi-layer pwb in a shorter amount of time.

applicable for even micro lands, components in a narrow space or flat type terminals on the pwb of downsized devices like mobile phone.

secure desoldering, with special valve function - suction starts 0.2 seconds after pulling the trigger for instant high pressured suction to achieve complete desoldering.

reduction of solder clogging through an improvement in the heating core.

 acf (anti clogging function) ensures suctioned solder be carried to filter pipe by keeping the pump running for a certain period of time (1 to 5 seconds) automatically after releasing trigger.